- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
Patent holdings for IPC class H01L 23/538
Total number of patents in this class: 9080
10-year publication summary
|
606
|
617
|
624
|
817
|
1023
|
1176
|
1099
|
1107
|
1033
|
456
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1865 |
| Intel Corporation | 45621 |
945 |
| Samsung Electronics Co., Ltd. | 131630 |
735 |
| Advanced Semiconductor Engineering, Inc. | 1546 |
229 |
| Qualcomm Incorporated | 76576 |
213 |
| Micron Technology, Inc. | 24960 |
185 |
| STATS ChipPAC Pte. Lte. | 1516 |
166 |
| International Business Machines Corporation | 60644 |
116 |
| Infineon Technologies AG | 8189 |
113 |
| Mediatek Inc. | 4584 |
106 |
| Murata Manufacturing Co., Ltd. | 22355 |
100 |
| Samsung Electro-mechanics Co., Ltd. | 4798 |
98 |
| Invensas Corporation | 645 |
95 |
| Apple Inc. | 50209 |
92 |
| Amkor Technology Singapore Holding Pte. Ltd | 314 |
89 |
| Jcet Semiconductor (shaoxing) Co., Ltd. | 366 |
89 |
| SK Hynix Inc. | 11030 |
81 |
| Siliconware Precision Industries Co., Ltd. | 489 |
71 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
70 |
| Fuji Electric Co., Ltd. | 4750 |
69 |
| Other owners | 3553 |